Advanced Packaging and Chiplet Summit 2024

With demand for high-performance computing (HPC) using more and more HBM stacks, package sizes grow larger.  Tight pitch is required for advanced logic devices.  What is the best package option to meet future needs?  This presentation discusses the trends in Si and RDL interposers and describes packages that have adopted this option.  Developments in glass core substrates are presented, including advantages and challenges. Future HPC package needs are described and a discussion of the merits of each option by application is presented.
 

Over the past two years, rapid advancements in AI and High-Performance Computing have driven software needs beyond available hardware resources, intensifying a global hardware shortage. Data centers and cloud providers are especially impacted, as they race to deliver efficient, high-performance solutions. With Moore's Law slowing, advanced packaging technologies are now vital for sustaining scaling and performance.  Japan's long-standing expertise in packaging materials and tools supports these efforts, though co-design with silicon providers and global collaboration is essential to optimize Total Cost of Ownership (TCO). To succeed in this competitive landscape, companies must make bold, large-scale investments.
 

Advanced packages deliver the highest density interconnect between chips and are implemented as pivotal enabling technologies for ultrahigh performance module or system. This presentation will explore the design variation, structural difference and developing challenges of the advanced packages for new generation heterogeneous integration with power efficiency to applications on AI server, data center and network computing.
 

本講演では、半導体産業におけるチップレット技術の革新的な役割と、その未来の可能性について探究します。従来のモノリシックなチップ設計の限界を超え、異なるプロセス技術や機能を組み合わせることで、性能向上、コスト最適化、設計柔軟性を実現するチップレット技術は、半導体設計の新たなパラダイムシフトを促進します。この技術が具体的にどのように半導体業界を変革し、次世代デバイスにどのような影響を与えるのかを解説し、将来的な応用とその可能性を考察します。