Advanced Packaging and Chiplet Summit 2024

With demand for high-performance computing (HPC) using more and more HBM stacks, package sizes grow larger.  Tight pitch is required for advanced logic devices.  What is the best package option to meet future needs?  This presentation discusses the trends in Si and RDL interposers and describes packages that have adopted this option.  Developments in glass core substrates are presented, including advantages and challenges. Future HPC package needs are described and a discussion of the merits of each option by application is presented.
 

Over the past two years, rapid advancements in AI and High-Performance Computing have driven software needs beyond available hardware resources, intensifying a global hardware shortage. Data centers and cloud providers are especially impacted, as they race to deliver efficient, high-performance solutions. With Moore's Law slowing, advanced packaging technologies are now vital for sustaining scaling and performance.  Japan's long-standing expertise in packaging materials and tools supports these efforts, though co-design with silicon providers and global collaboration is essential to optimize Total Cost of Ownership (TCO). To succeed in this competitive landscape, companies must make bold, large-scale investments. 
 

Advanced packages deliver the highest density interconnect between chips and are implemented as pivotal enabling technologies for ultrahigh performance module or system. This presentation will explore the design variation, structural difference and developing challenges of the advanced packages for new generation heterogeneous integration with power efficiency to applications on AI server, data center and network computing. 
 

In this presentation, we will explore the innovative role of chiplet technology in the semiconductor industry and its potential for the future. By surpassing the limitations of traditional monolithic chip design and combining different process technologies and functionalities, chiplet technology enables performance enhancement, cost optimization, and design flexibility, driving a paradigm shift in semiconductor design. We will explain how this technology is transforming the semiconductor industry and its impact on next-generation devices, as well as discuss its future applications and possibilities.