Advanced Packaging and
Chiplet Summit

Leading companies and organizations from across the industry will showcase the latest technologies and solutions.

As the importance of design continues to grow in advanced packaging and chiplet development, the ADIS (Advanced Design Innovation Summit) exhibition area, focused on design and verification, will also be located adjacent to APCS.

We encourage you to explore both exhibition areas together.

The Future Shaped by Data Centers
Connecting the Possibilities of an AI Society Through Advanced Packaging

Driven by the rapid evolution of AI and the growing demand for data centers, advanced packaging technologies are entering a new phase of growth.
This conference will explore the requirements and future directions of advanced packaging from the perspectives of data centers, memory, and ASICs through keynote presentations. In addition, a panel discussion featuring experts in optics, electronics, and thermal management will examine the challenges and opportunities of enabling the AI era.
The program also covers a broad range of topics, including ecosystem development, equipment manufacturers’ strategies, substrate and interposer technologies, and future innovation initiatives led by the next generation of engineers. Through these sessions, participants will gain insight into the future landscape of advanced packaging and heterogeneous integration technologies.

Seminars & Conferences 2026
・Advanced Packaging and Chiplet Summit 2026
・Advanced Packaging and Chiplet Summit 2026 Panel Discussion
　The Future of Advanced Packaging Enabled by Data Centers
・APCS Technology Session I Ecosystems for CPO and 2.5D/3D Integration
・APCS Technology Session Ⅱ Strategies of Leading Equipment Manufacturers
・APCS Technology Session Ⅲ Substrates and Interposers
・APCS-Next Session Beyond Boundaries: How Semiconductors Will Transform People, Industries, and Space

Following last year’s success, the invitation-only networking event will be held again this year.

This time, the event will expand to include participants from ADIS (Advanced Design Innovation Summit), which focuses on semiconductor design and verification. Exhibitors, speakers, and committee members from both APCS and ADIS are expected to attend.

It will be a valuable opportunity to build cross-disciplinary connections—don’t miss it.

We will provide a comprehensive overview of semiconductor packaging—from fundamental concepts that underpin the evolution and advancement of semiconductors to the latest cutting-edge technologies—divided into two sessions in the morning and afternoon.

2026 Educational Courses
・Overview of Back-end Processes for Early Carrer Engineers I
・Overview of Back-end Processes for Early Carrer EngineersⅡ