As of 10/7/2026
Ryosuke Seta - Chairman
SoC Handler Lead,
SoC Product Promotion Dept.,SoC BD Div.
Sales Group,
ADVANTEST
Takeshi Saito - Vice Chairman
Packaging Solution Center,
Electronics Business Headquarters,
Resonac
Shota Miki - Vice Chairman
Senior Chief Engineer,
Advanced Package Development Dept.
Research & Development Div. Senior Manager,
Marketing Dept. Marketing & Sales Div.
SHINKO ELECTRIC INDUSTRIES
Shinobu Gonsui
Engineering R&D Division,
DISCO
Risa Miyazawa
Researcher,
Chiplet Interconnect, Semiconductors,
IBM Research-Tokyo,
IBM Japan
Fumiya Ishizawa
Assistant Manager,
Marketing Division 1,
JAPAN PURE CHEMICAL
Tomohiro Okada
Assistant Manager,
Technology Dept.
Semiconductor & Incubation Center,
Industrial Automation Company,
OMRON
Daisuke Sakae
Senior Engineer,
Chiplet Solutions Design Department,
Chiplet Solutions Division,
Rapidus
Mitsutake Suematsu
Packaging Engineer,
Section 4,Department 4, Research Division 2,
Research and Development Center,
Sony Semiconductor Solutions
Norikazu Hitaka
Sales Promotion Team,
Sales Strategy Group, Sales Division,
Yamaha Robotics
Yuri Saito
Manager,
Corporate Marketing Department,
Administration Division,
ZUKEN