Executive Summit

Our industry is quickly moving towards a 1T market, driven by AI. As AI use cases and demand increase, it also drives increased semiconductor demand and improved performance, bandwidth, power, capacity requirements. To meet these requirements, we are also increasingly reliant on AI to help us achieve our development, manufacturing excellence, and sustainability goals.

マイクロンメモリ ジャパン株式会社のDRAM開発部門、白竹 茂シニアバイスプレジデントが「時代を変革するAIと、その発展を支えるマイクロン」について語ります。マイクロンは、最先端のメモリやストレージソリューション提供を通じてAIの可能性を広げています。AIワークロード向けDRAMテクノロジーにおける課題や技術革新、日米大学間パートナーシップ（UPWARDS）、日本の半導体エコシステムとの関わり、共同研究やコミュニティとの協働など、マイクロンの様々な取り組みや展望についてご紹介します。「AIのあるところに必ずマイクロンがあります。マイクロンジャパンはAIの発展を支えています」

The presentation, introduced by Vincent DiCaprio, Vice President of the Semiconductor Products Group, highlights the crucial role of semiconductors in driving technological advancements such as renewable energy, electric and autonomous vehicles, data center AI, and edge AI and IoT, with market projections for 2030. It emphasizes how AI is accelerating the transition to advanced packaging and the evolution of Moore's Law through heterogeneous chip design, underscoring the importance of packaging in achieving the $1 trillion semiconductor market. The significance of ICAPS and packaging in energy-efficient computing is also highlighted, along with the role of advanced packaging in enabling larger packages. Additionally, the presentation addresses the challenges and innovations in advanced packaging, including hybrid bonding, interconnect scaling, and panel processing.

Surging demand for AI and the need to secure regional supply chains are driving a global race to build the fabs of the future. In this talk, Lam Research will discuss how equipping fabs with advanced AI troubleshooting, smart tools with innovative sensors, and collaborative service robots is supporting semiconductor manufacturers in their vision to create fully autonomous fabs. These innovations will address perpetual labor shortages, drive faster ROI on the escalating costs of building and maintaining fabs, and ensure that equipment is managed with levels of precision and repeatability that are not achievable by humans alone. Discover how next-generation technologies will revolutionize productivity in equipment installation, maintenance, and fab performance, setting the stage for the future of semiconductor fabrication.

デジタル化と脱炭素化の両立する社会に向け、半導体は2030年には1T$に成長を続けると理解し、TELは引き続き絶え間ない技術革新を提供することで、その実現に最大の貢献を果たしていく。近年の技術革新による新製品の事例の紹介と、AI、自動化対応など今後の取り組みについて紹介する。