Executive Summit

Our industry is quickly moving towards a 1T market, driven by AI. As AI use cases and demand increase, it also drives increased semiconductor demand and improved performance, bandwidth, power, capacity requirements. To meet these requirements, we are also increasingly reliant on AI to help us achieve our development, manufacturing excellence, and sustainability goals.

Shigeru Shiratake, SVP of Technology Development at Micron Technology, will discuss the transformative power of AI and Micron’s pivotal role in this revolution. He will address the challenges and innovations in DRAM technology for AI workloads, highlight Micron's vision of unleashing AI potential through advanced memory and storage solutions, and outline strategic actions such as the UPWARDS initiative, leveraging Japan's ecosystem partners, and commitments to research and community collaboration.  "Everywhere there is AI, there is Micron. Micron Japan is at the heart of it."

The presentation, introduced by Vincent DiCaprio, Vice President of the Semiconductor Products Group, highlights the crucial role of semiconductors in driving technological advancements such as renewable energy, electric and autonomous vehicles, data center AI, and edge AI and IoT, with market projections for 2030. It emphasizes how AI is accelerating the transition to advanced packaging and the evolution of Moore's Law through heterogeneous chip design, underscoring the importance of packaging in achieving the $1 trillion semiconductor market. The significance of ICAPS and packaging in energy-efficient computing is also highlighted, along with the role of advanced packaging in enabling larger packages. Additionally, the presentation addresses the challenges and innovations in advanced packaging, including hybrid bonding, interconnect scaling, and panel processing.

Surging demand for AI and the need to secure regional supply chains are driving a global race to build the fabs of the future. In this talk, Lam Research will discuss how equipping fabs with advanced AI troubleshooting, smart tools with innovative sensors, and collaborative service robots is supporting semiconductor manufacturers in their vision to create fully autonomous fabs. These innovations will address perpetual labor shortages, drive faster ROI on the escalating costs of building and maintaining fabs, and ensure that equipment is managed with levels of precision and repeatability that are not achievable by humans alone. Discover how next-generation technologies will revolutionize productivity in equipment installation, maintenance, and fab performance, setting the stage for the future of semiconductor fabrication.

Towards a society where digitalization and decarbonization are compatible, we understand that semiconductors will continue to grow to 1T$ by 2030, and TEL will continue to provide relentless technological innovation to make the greatest contribution to the realization of this goal. We will introduce examples of new products resulting from recent technological innovations, as well as future initiatives such as AI and automation.