Shin-Etsu Chemical Co., Ltd.
proposal of manufacturing equipment and new methods for next-generation semiconductor packages.
Thursday, December 12 | 2:30 pm - 2:50 pm
Hall5 (East Hall5 Theater)
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we will propose the equipment and new production methods for semiconductor package substrate back end processing. by coming our materials technology with our unique excimer laser technology, we are able to achieve microfabrication that enables the incorporation of interposer functions into them.