ARGO CORPORATION

【Nexensor Inc.】Optical measurement of micro structures on advanced packaging process

Wednesday, December 11 | 3:30 pm - 4:20 pm

Hall4 (East Hall4 Show Office)

Free

【Nexensor Inc.】Chips in mobile, AI, and HBM industries are produced using advanced packaging like FOWLP. Quality control needs measurements of wafer and die warpage, surface roughness, and TSV depth. This presentation proposes a solution for these measurements.