Overview of Semiconductor Manufacturing Process
East Hall 7
This session will cover key features of semiconductor production technology, structure of CMOS, individual technologies used in the production of MOS LSIs, applications, principles and the basic structure of devices. The challenges facing cutting-edge miniaturization technologies will also be outlined.
Program Agenda
*Please note that the program may be subject to change.
Planar technology, as the peculiarity of semiconductor device fabrication, and fundamental structure of CMOS are briefly introduced first. Next, process flow of sub-100nm CMOS fabrication is presented. Main technologies used in the fabrication of CMOS LSIs are described in 3 viewpoints; their application in the process flow, basic mechanisms of the technology and structure of machines used. Finally, with the summary of semiconductor device fabrication technology, the technologies to enhance the device performance more and issues emerged in leading edge fine devices are introduced also.