Semiconductor Technologies in the HPC Era
The Latest Development of Technologies
Friday, December 13 | 12:30 pm - 2:10 pm
East Hall 2
High-performance computing (HPC) applications, such as generative AI, are rapidly transforming the world, and this is only possible with the advanced semiconductor technologies. In this program, the technology leaders will share their technology visions.
Program Agenda
*Please note that the program may be subject to change.
12:30 - 13:03
Advanced Packaging Technology for Future HBM
Ho-Young Son
VP, Advanced Package Development
SK hynix
13:03 - 13:36
Canon’s Semiconductor Manufacturing Solutions Supporting High Performance Computing (HPC)
Hiroaki Takeishi
Senior Managing Director / Head of Industrial Group / Chief Executive Optical Products Operations
CANON
The expansion of IoT and GenAI increases demands of high-performance semiconductors.
To meet these demands, advanced packaging technologies such as 3D integration in back-end processes are crucial as well as miniaturization and vertical stack construction in FEOL.
We will introduce Canon's manufacturing solutions to address further evolution of semiconductors.
13:36 - 14:09
Sustainable Generative AI through Semiconductor Innovations
Mukesh Khare
General Manager, IBM Semiconductors; Vice President Hybrid Cloud Research
IBM
Stage Sponsors
