Strategies and Technologies in the New Semiconductor Era
Top Chip Manufacturers Talk about Strategies and Focused Technologies
East Hall 2
The chip industry environment is changing dramatically: Semiconductors are considered to be the key to the promotion of new goals to tackle climate change and other issues symbolized by the SDGs, the acceleration of digitalization such as post-5G, and the realization of social transformation such as DX and GX. The semiconductor industry has truly entered a new era in to meet the demand for higher performance and power saving. Leading industry players will discuss their strategies and technologies to sustain growth in this new environment.
Program Agenda
*Please note that the program may be subject to change.
TSMC Japan 3DIC R&D Center
AI and HPC are reshaping the semiconductor industry, positioning themselves as key growth engines that propels technology advancement and market growth 3D IC packaging solutions. With the rapid rise of AI and HPC applications, 3D IC technologies are emerging as a critical enabler. Realizing the full potential of 3D IC requires manufacturing excellence, seamless integration across ecosystems, and early-stage partnerships between chiplet integrators, tool and material suppliers, and the HBM/substrate industries. Such collaborations are imperative to meet the increasing complexity and performance demands of next-generation devices.
Innovative packaging technology for semiconductors that enables generative AI is attracting attention. Resonac, which aims to be a co-creation chemical company, is promoting the consortium activity "JOINT2" with domestic and overseas material, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technology. In this presentation, we will introduce the value brought by co-creation, material innovations through co-creation activities, and overseas strategies.
Stage Sponsors
