APCS TechnologyⅢ User Perspective Session

User Demands and Expectations for Advanced Semiconductors and 3D Packaging.

Friday, December 13 | 10:30 am - 12:10 pm

(Reception B, Conference Tower 1F)

We will discuss expectations and challenges for advanced semiconductor technologies from a user perspective. We will introduce technological innovations in the automotive industry, integrators' initiatives, and new solutions from EDA that visualize requirements and constraints.

Program Agenda
^{*Please note that the program may be subject to change.}

10:30 - 11:00

Processes and Infrastructure Required to Achieve SDV

Hiroki Ando

Honda Motor

Development Strategy Division

Senior Chief Engineer

11:00 - 11:30

Challenges and Initiatives of Fabless Company Providing Advanced, Large-Scale SoCs Optimized for Customer

Mitsugu Naito

Socionext

Corporate Executive Vice President

In order to respond to various demands from customers (Performance, cost and delivery time), we select and negotiate with various semiconductor eco-partners in order to realize a complete service including chip specification examination, design and quality for SoC development in fabless company.From this perspective, I will introduce Socionext's efforts and challenges regarding expectations for advanced packaging technologies such as chiplets and SoC development, which is becoming more complex.

11:30 - 12:00

Multi-Die Design in the Pervasive Intelligence Era

Kenneth Larsen

Synopsys

Sr. Director Technical Product Management

Session Chair

Kazuhiro Kariya

ZUKEN

APCS TechnologyⅢ User Perspective Session

User Demands and Expectations for Advanced Semiconductors and 3D Packaging.

Program Agenda*Please note that the program may be subject to change.

Session Chair

Program Agenda
^{*Please note that the program may be subject to change.}