APCS TechnologyⅡ Glass Substrates Session
Glass Substrates are Gaining Attention, and You Can Learn About Their Key Technologies and Applications.
ConferenceHall TheSUMMIT B
Glass substrates have been expected to be used as substrates for next-generation semiconductors because of their excellent characteristics. Recently, its practical application has become a reality, especially in chiplets, which are said to support the future evolution of semiconductors. In this session, the progress of various elemental technologies and application trends that are the key to the practical application of glass substrates will be comprehensively explained.
Program Agenda
*Please note that the program may be subject to change.
Satoru Kuramochi received the B.E.degrees and M.E.degrees in image science engineering from Chiba University japan, in 1987 and 1989, respectively. He joined Research and Development Center, Dai Nippon Printing Corporation, Japan in 1989. He specializes in the fine pattern processes for high density packaging substrate. He holds 51 patents, has published 30 technical papers concerning to high density substrate technologies.
The use of glass as carrier substrates or core materials of packaging substrates is attracting attention due to its rigidity, flatness and dimensional stability for advanced packaging such as chiplet packaging. This presentation will provide an overview of glass material technology and processing technology for glass carriers and glass core substrates for advanced packaging.
Session Chairs