STS Photomask Session
Current Status and Latest Technology Trends of the Photomask
Conference Tower 607 / Online (Zoom)
Fee (Exclusive of tax)
- Per Session : SEMI Members 10,000JPY / Non-Members 20,000JPY
- STS 1 Day Pass : SEMI Members 27,000JPY / Non-Members 54,000JPY
*Above fee includes "Download Presentation Materials" (some presentation materials might be written in Japanese)
*Please note that there are separate tickets for in-person and online participation.
This session will cover the current state of photomasks, which support a wide range of semiconductor manufacturing processes from legacy to cutting-edge, the development history of EUV blanks, in which Japan holds a 100% market share, the outlook for low-n PSM and large masks, and the Actinic pattern inspection technology for high-NA EUV masks, which is finally being applied, with user reports.
< SEMI Technology Symposium (STS) >
This first technology seminar series in SEMICON Japan founded in 1982, now grown to the international tech symposium marks the 43rd this year. It has been developed as a place to discuss technology among engineers by picking-up the semiconductor technology trends and its issue and sharing the practical technologies to the industry. This symposium stimulates global business growth by involving a variety of different players and visitors.
This program is organized thanks to "SEMI Technology Steering Committee (STS)" formed by top engineers from industry-leading companies, universities, and research institutions.
Program Agenda
*Please note that the program may be subject to change.
Session Chairs: *In alphabetical order by company name
Kazuyuki Suko (Dai Nippon Printing), Daisuke Kenmochi (HOYA), Toshio Konishi (Tekschend Photomask)
Photomask is master template used to transfer circuits onto semiconductor wafer, making it indispensable component in the semiconductor manufacturing process. This presentation will show the positioning of the photomask market within the semiconductor industry and provide future market outlook. It will also introduce key technologies in the development of EUV mask, most advanced photomasks. In addition, it will discuss trend in legacy photomask, which continues to play a significant role in the market.
HOYA
EUV lithography has been applied to the manufacturing of advanced semiconductor devices since 2019, and is expected to be used and expanded in the future. This presentation will touch upon the challenges and actual activities in the early stages of development as the history of blanks for EUV lithography, provide details on blank structure and materials, and then explain the technological trends and outlook for the next generation EUV blanks.
High-NA EUV lithography is developed to provide the resolution necessary for the technology nodes of 2nm and beyond. Actinic mask inspection has been adopted by device makers to detect small printable defects for high-NA EUV mask qualification. This seminar discusses actinic mask inspection technologies for high-NA.