For Those Presenting in

3Logos

 


Thank you so much for your acceptance of speaking at SEMICON Japan. Please check the following information for your presentation.

 

SUBMISSION

by August 25, 2023

  • Requested Form (Download the Form HERE)
    • Info. and Biography
    • Presentation Title
    • Presentation Summary  *about 150 words
       
  • Head Shot
    • File Type: JPEG
    • File Size: High-resolution preferred for printing  *desirably 700,000 px+
    • Color pic. with colorless or light-colored background is recommended.
       
  • Letter of Agreement

 

by December 7, 2023

  • Presentation Slides Data
    • Format: Microfost PowerPoint (Aspect Ratio 16:9 recommended)
    • You can download the PPT template below as appropriate for your session.
    • SEMICON Japan ver.  /  Advanced Packaging and Chiplet Summit ver.
      • Please let us know in advance if your presentation contains any movie or sound.
      • Please eliminate the pages that say "Confidential"

On Presentation Day

ACCESS

MEETING TIME

Unless otherwise requested, please come to the Reception Desk by 30 min before your session.

  • For those who are presenting at Panel Discussion Sessions
    > Please ask 


Equipment at the Venue

  •   PC (Windows10, PowerPoint2019)
  •   Laser Pointer / Clicker
  •   Microphone
  •   Connector (HDMI, RGB[D-Sub15])

*Please let us know in advance if you are presenting with your own PC on the day although it would be highly appreciated if you could present with the PC at the venue.
 

Presentation Procedure

  1. Please take a seat in the front rows. Our staff will guide you.
  2. Please go up on a stage and start your presentation when the moderator introduces you.
  3. Please refer to the signs indicating the remaining time for your presentation.
  4. After finishing presenting, please go back to your seat and listen to other presentations.
BENEFITS
Accommodation

[Deadline: November 9th (JST)]
 

Question?

SEMICON Japan 2023 Contact for the Presentation
[email protected]