EBARA CORPORATION

Panel Level Packaging technology and market -rising expectation and EBARA's equipment solutions-

Thursday, December 12 | 10:30 am - 10:50 am

Hall5 (East Hall5 Theater)

Free

In recent years, expectations for Panel Level Packaging (PLP) technology have been rising rapidly with the increasing demand for AI semiconductors. This seminar will provide an overview of EBARA's PLP equipment (CMP and Plating equipment) as well as recent developments in the PLP market.