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半導体グローバルリーダーが語る ― Part 2: 海外リーディング企業からの提言

2020/12/16(水) | 15:30 - 16:30

日本語字幕つき

 

日本の半導体サプライチェーンは半導体製造装置の1/3、半導体材料の1/2以上を世界市場に供給し、またクリティカルサブシステムを含むコンポーネントや高品質・高性能素材においても重要な供給拠点となっています。この日本が世界に誇る半導体サプライチェーンについて、世界のリーディング企業のトップが、海外顧客の視点からの提言を語ります。米国からはIntel Chief Supply Chain OfficerのRandhir氏が、台湾からはTSMC Chief ScientistのH.-S. Philip Wong氏がオンライン中継で登壇し、半導体産業のトップランナーたちが日本のサプライヤーに何を望み、何を求めているかを語ります。

 ★このセッションはライブ配信直後から2021年1月15日の期間、オンデマンドでも配信されます

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Speakers

Randhir Thakur

Randhir Thakur

Intel Chief Supply Chain Officer

Unleashing the Potential of Data: Opportunities for the Semiconductor Ecosystem
Data has emerged as a transformational force in an era where an explosion of devices permeate all our interactions. The volume of data generated by our homes, cars, cities, phones, appliances, is growing exponentially. Even today, more data is generated every day than we can secure, transmit, store, and process to extract the insights that can make this world a better place. This creates insatiable demand for computing solutions that unleash the value from this data. Intel’s roadmap of innovations enables the breakthroughs required in computing products to address this growing demand.
In the next few years, silicon and package technology will be transformed through innovations such as die disaggregation, advanced packaging, EUV, nanometer-resolution inspection, and atomically engineered materials. Bringing these innovations to maturity for high-volume manufacturing requires substantial R&D investment, and improvements across the supply chain in process control, quality, and traceability. Through close collaboration with our ecosystem partners, we are looking forward to not only advancing technology to enable business growth, but through our technology and collective actions, to create a more responsible, inclusive, and sustainable world.

H.-S. Philip Wong

H.-S. Philip Wong

Willard R. and Inez Kerr Bell Professor, Department of Electrical Engineering, Stanford University and Chief Scientist, TSMC

Session Sponsor