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SEMI Technology Symposium (STS) 2008

Featured Sessions

Special Program: Next Generation Energy Devices
The STS Special Program focuses on key technologies that have the potential to help us produce and use energy more efficiently and combat global warming. Technologies covered include photovoltaics, energy-saving light-emitting diodes (LEDs) and silicon carbide (SiC) power devices. Details and Registration

Image: Green leaves. Semiconductor technology is being used to combat global warming.

Inspection & Metrology
Complex device structures and shrinking geometries mean that wafer inspection and metrology will play an important role in the 32nm hp node. STS session 3 presents the specifics required of inspection and metrology, and also the state of current leading-edge research in the field. Details & Registration.

Image: Inspection & Metrology.

Schedule

Dec 03

10:00–16:55

Session 1: Special Program: Next Generation Energy Devices
Key Semiconductor Technologies to Tackle Global Warming:
Solar Cells, Energy-saving LEDs and SiC Power Devices

10:00–17:40

Session 2: Microsystems/MEMS
New Developments of MEMS Business and MEMS Equipment

12:35–13:00

The 15th Annual STS Award Ceremony & Commemorative Speeches

14:00–16:40

Session 3: Inspection & Metrology
Key Technology Trend of Inspection & Metrology for the 32nm hp node

Dec 04

10:00–12:50

Session 4: Etching
Ultrafine Etching Technology for the 32 nm node
—Combination of Profile Variability Control and Metrology—

13:30–17:05

Session 5: Multi-Level Interconnection
The Future of Highly-reliable Next Generation Interconnects with the Innovation of New Materials and Structures

10:00–17:00

Session 6: DFM / Mask
Mask Technologies for 32nm and Beyond
— From Optical Extension to NGL—

10:00–18:30

Session 7: Testing
Breakthrough of Testing Technology
—From Innovation to Confidence—

Dec 05

10:00–17:05

Session 8: Advanced Devices
32nm/22nm Node Device and Process Technology

10:00–17:00

Session 9: Lithography
Explore the Future of Immersion Lithography and Beyond

10:00–16:40

Session 10: Packaging
Wafer Level vs Packaging Level
—Which will Play a Leading Role in Diversified 3D Technologies?—

 
 
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