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Standards Special features

Standards Special features

SEMI Standards 

SEMI Standards support to make 3D Packaging/
WLP etc and manufacturing lines smarter.

Booth

3D Packaging & Integration

FO-PLP used materials such as encapsulants, PLP FOUP and PLP panels are exhibited in the booth. SEMI related documents and PLP technical documents are displayed in the booth.

How Industry Standards are helped to accelerate the PLP wider adoption in the market?

10:20-11:10, Thursday, December 13

TechSPOT INNOVATION&IOT(East Hall 3)

 

Information & Control(I&C)

Introduction on SEMI Standards, which make semiconductor manufacturing line smarter; “GEM300” Standards, “EDA (equipment data acquisition)” Standards, and “GEM300A” Standards including the Standard for secured and operation-oriented recipe management.

#SECS, #DataAcquisition, #FabControl, #Recipe, #Security, #FabOperation

SEMI Factory Automation Standards, the Enabler of Smarter Fab Operation

11:20-12:10, Wednesday, December 12

TechSPOT INNOVATION&IOT(East Hall 3)

 

Automation Technology(AT)

Introduction on advanced M2M interface “SEMI A1 Horizontal Communication” which makes flow-shop type manufacturing line smarter by “Simultaneous transportation of material and its data” and “Autonomous cooperation among equipment”.

#FlowShopLine, #ObjectOriented, M2Minterface, #SMEMA, #SMT, #PCB

SEMI A1, A Smart M2M Interface to Realize Connected Factory

11:20-12:10, Thursday, December 13

TechSPOT INNOVATION&IOT(East Hall 3)

 

Floor Map

SEMI Standards

East Hall 2
Booth No. 2751

Detail

Floor map 


Question?

SEMICON Japan 2018 Show Management Support (Sakura International Inc.)
Tel : +81-50-5804-1281
*Available Mon - Fri (except holidays) from 9:30 - 12:00/13:00 - 17:30 (local time)
Email : semicon@sakurain.co.jp

 

 

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