SEMI EHS Standards Workshop:
EHS Challenges for 450mm
Wednesday, December 4
Room 304, 3F, International Conference Hall, Makuhari Messe
The increased wafer size and weight at 450mm is expected to bring additional environmental health and safety related challenges to the semiconductor industry. This workshop will explore those challenges by focusing on risk assessment, ergonomics, lifting related issues, and environmental impact mitigation demands to identify applicable SEMI Standards or lack of such Standards.
The workshop will also include a panel discussion where attendees can share their 450mm EHS concerns.
Supika Mashiro, Tokyo Electron
Hidetoshi Sakura, Intel
Moray Crawford, Hatsuta Seisakusho
Synergy Between SEMI ESH Standards and 450mm Consortium Efforts
General Manager, Industry/Stategy
The 450mm transition represents an opportunity for the industry to improve the sustainability of its operations through attention to efficient use of resources and minimization of effluents, as well as to optimize equipment and infrastructure for safety and ergonomics. The G450C program will verify compliance with applicable SEMI safety and ergonomics standards and characterize the use rates of process materials as part of its demostrations. The industry is also coordinating globally to address challenges related to critical materials like GHGs, He, water, etc. that may be more important with manufacturing on larger wafers.
Prominent Hazard in 450mm Equipment and Risk Assessment 1
The next generation wafer “450mm correspondence” is one of the motions which have large influence on SME Industry. Shift to 450 mm has many technological issues compared with shift to 300 mm. Also, it is thought that safety hazards also increase. Here, Prominent hazard in 450mm Equipment and the contents which should be taken into consideration in risk assessment are described
Prominent Hazard in 450mm Equipment and Risk Assessment 2
Along with the scale-up to 450-mm wafer, many SME mauncaturers face to scale up the size of their products.
Relation between SEMIS10 and ISO 13849-1
Dainippon Screen Mfg.
In SEMI there is a SEMI S10 that is guideline for risk assessment. When the equipment is designed ,its designs based on SEMI S10 and do the protective measures. Its interlock such as protective measures do risk assessment based on ISO 13849-1 to determine PLr . In this session, I explains about selection of Plr relates between SEMI S10 and ISO13849-1.
SEMI S2 and SEMI S8
Senior Engineer, JCME
This session focuses on what kind of impact is expected to meet SEMI S2 and S8 for 450mm Semiconductor manufacturing equipment.
Description of a SEMI environmental guide (S23, 29)
Group Leader, Senior Manager
TOKYO ELECTRON LIMITED
About energy saving and the measure against greenhouse gases (F-GHG) which are the two major points in an environmental programs. It introduce about the contents of SEMI S23 (Guide of the equipment energy conservation using electric power energy conversion factor) and SEMI S29 (Guide of F-GHG emission measurement) and effective use.
Panel Discussion: EHS Challenges for 450mm
Frank Robertson, G450C
Naokatsu Nishiguchi, Dainippon Screen Mfg.
Yuji Hamano, TUV Rheinland Japan
Eiji Nakatani, Dainippon Screen Mfg.
Hidetoshi Sakura, Intel
George Hoshi, Tokyo Electron
Summary & Closing
SEMI EHS Standards Workshop: EHS Challenges for 450mm
* Consumption tax (5%) not included.
You may also be interested in the following sessions:
- 450mm Executive Forum
- 450mm Transition Status with SEMI Standardization View
- 450mm Manufacturing EHS and Facilities Seminar
- Int'l EHS Compliance and Regulatory Seminar
- SEMI EHS & Sustainability Update 2013
- Proposals to the Assembly Technologies to Drive 3D-IC