Exhibitor Presentations Schedule: December 4


 

Exhibitors Seminar Room (Room 103, International Conference Halls)

13:30-14:20

EtherCAT Technology in semiconductor manufacturing. Guest speaker is Applied Materials Japan introduce ”Advantage of EtherCAT and the application example”


EtherCAT Technology Group

 

ETG will introduce “EtherCAT Technology in Semiconductor manufacturing” and also update of EtherCAT semi device profile. The advantages of EtherCAT and the application will be presented by the guest speaker from Applied Materials Japan.

 

14:30-15:20

EVG's HVM solution updates for Automotive & SmartPhone applications

EVGroup Japan K.K.

 

The demands for automotive devices are rapidly increasing especially for Si, SiC, GaN power devices, various sensors using MEMS. In addition, smartphones are equipped with many components such as camera modules, RF filters as well as MEMS devices. EVG proposes HVM solutions for these electronic components.

 

15:30-16:20

China Wafer Foundry Status and FMIC Company Introduction

Founder Microelectronics International Co.,Ltd.

 

There are 12/8/6 inch wafer fab in China,  we will illustrate the wafer foundry status of China. FMIC is one of the 6inch   fab. we can provide wafer foundry services to design houses and IDMs home and abroad. The total capacity is around 60,000wafers per month.

 

 

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TechSTAGE EAST (Exhibition Hall 6)

11:30-12:20

China Wafer Foundry Status and FMIC Company Introduction

Founder Microelectronics International Co.,Ltd.

 

There are 12/8/6 inch wafer fab in China,  we will illustrate the wafer foundry status of China. FMIC is one of the 6inch   fab. we can provide wafer foundry services to design houses and IDMs home and abroad. The total capacity is around 60,000wafers per month.

 

12:30-13:20

The manufacturing by the medium and small enterprise.(part 1).

Organization for Small & Medium Enterprises and Regional Innovation, JAPAN (SMRJ)

 

13:30-14:20 Introduction of our thinning process for power and sensor device maker to meet their needs and proposal of  wafer grinding technics for 6inches SiC

Rokko Electoronics Co.,Ltd.

 

To meet rising customer demands require thinner wafers for power and sensor devices, We will introduce our services such as[Knife-edged prevention] ,[Original cleaning process for back surface of patterned wafer](towards customers having problems like particles and metal contaminations),and propose our grinding,CMP and cleaning technics for 6 inches SiC、Sapphire wafer.

 

14:30-14:50

Introduction of Chemical-substance Management System and JAMP Consortium

Joint Article Management Promotion-consortium

 

Management of chemical-substance is important in the world. We explain JAMP-consortium activity that promote the chemical information declaration.

 

15:00-15:20

The latest situation on chemical regulations in China

Honeycomb Technoresearch

 

In our seminar, we explain the point based on the latest trend how the companies which exports chemical products to China from Japan should cope about chemical regulations in China, or what kind of thing they must warn.

 

15:30-15:50

Introducing the many advantages of smart.DITA for Confluence as a DITA document solution!

Tec Communications CO.,Ltd

 

DITA is an XML-based international standard for converting individual topics in a document into components so they can be reused more frequently. To alert more people to the benefits of DITA, in this seminar, we will introduce a flexible solution that incorporates templates and a Wiki.

 

16:00-16:20

Risk Management Seminar

SGS Japan Inc

 

SGS is a Swiss based leading private testing and accreditation company.  We hold risk management seminar explaining work process for technical documents in CE mark conformity with RoHS recast Directive referring to its harmonized standard of EN50581 based on know-how through our huge analysis data base in our global networks.

 

 

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TechSTAGE WEST (Exhibition Hall 1)

10:30-10:50

Introduction of new technology for "Transient Analysis of Thermal Imaging"

ATN Japan, Ltd.

 

11:00-11:20

2.5D/3DPackaging stepper

USHIO INC.

 

11:30-11:50

Novel Slurry Injection System for Reduced Slurry Usage and Enhanced CMP Performance

Levitronix Japan K.K.

 

12:00-12:20

Soft UV NIL / lithography for patterns down to the deep sub-micron feature size

EVGroup Japan K.K.

 

12:30-12:50

3D IC technology and sevice of GINTI & T-Micro

Tohoku Univ. GINTI

 

GINTI(Global Integration Initiative) is the process line specialized for 3D IC. We are going to show the 3D IC technology and the service of GINTI . We can provide one stop solution from Concept, Design, Fabrication & Testing and 3D IC prototyping/pilot production service.


13:00-13:20

MEMS Processing in “Mechano Micro Processing Clean Room” of Tokyo Institute of Technology

Tokyo Institute of Technology , Mechano Micro Processing Lab.

 

This clean room is used as a system to support a university-wide research and interdisciplinary semiconductor device difficult correspondence, biotechnology, mechatronics. In this presentation, an overview of the facility will be introduces. Moreover, the technology developed in the semiconductor and MEMS processing center will be presented.

 

13:30-13:50

Trend of Used Equipment Market based on Supply &Demand

SurplusGLOBAL Inc.

 

To present the trend of the used equipment market based on supply and demand. To review the secondary semiconductor equipment market for 2013 and forecast market.

 

14:00-14:20

Innovations in Fab Scheduling to Minimize Cycle Time

SmartFabs Corp.

 

We present the latest breakthrough to significantly reduce cycle time for wafer fabs. Our techniques are robust and scalable, especially for large fabs or fabs at heavy load.

 

14:30-14:50

How to continue maintenance service to the EOSL product.

Shared Solution Service Co.,Ltd.

 

 

15:00-15:20

Optimized WLP structure and methods of mounting WLP for expanding it applicable to many devices

Tera Probe, Inc.

 

The contents of this presentation is focused on the relativity between the package structure and mounting package methods to the board depending on the device makers' purpose and requirements.
Also, at the same time, explaining the WLP current situation and trend.

 

 

 

 

15:30-15:50

 

 

 

OptimalTest Business Solution Overview

OptimalTest

 

OptimalTest's Business Intelligence Software uses proven analytics to transform your data into actionable information enabling proactive improvements in yield, operational efficiency and product quality. We enable customers to improve margins, increase customer satisfaction and optimize their Supply Chain. 

 

 

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