Full surface Flatness and Thickness measurement with FlatMasterMSP(Corning Tropel)  

SOL CORP.

topcon 3d inspection system

TOPCON CORP.

Determination of Ultra High Sensitivity Water Vapor Transmission Rate with API-MS

SUMIKA CHEMICAL ANALYSIS SERVICE,LTD.

Next Generation Macro Defect Inspection System

RUDOLPH TECHNOLOGIES JAPAN

Cost Effective Manufacturing of Patterned Sapphire Substrates

HIRO-TEC.CO.,LTD

Real-Time Heat Flux Monitoring System

CREATIVE TECHNOLOGY CORP.

WAFER MOTIONLESS CARRIER Next Generation Wafe Shipping System

ACHILLES CORP.

Haze　Analysis　Solutions　with　Newly　Developed　Solid Phase Sampler

SUMIKA CHEMICAL ANALYSIS SERVICE,LTD

DEBUGSCOPE To visualize the vibration and sound and noise. Discovery and surprise waiting for you.

RORZE CORP.

Photomask edge face visual inspection system

HIRO-TEC. CO., LTD

Gemini FB: New generation of high throughput Si fusion bonding for high volume CMOS image sensor manufacturing

EVGROUP JAPAN K.K.

Ultra Trace Impurity Analysis for SiC Thin Film and Materials

SUMIKA CHEMICAL ANALYSIS SERVICE,LTD

Cleaning solution services

KYODO INTERNATIONAL INC

13:30-13:50

Global Innovation on Plasma Nano Technology towards Next Generation Green and Life Science

GRADUATE SCHOOL OF ENGINEERING, NAGOYA UNIVERSITY, HORI&SEKINE LAB. (JSAP)

Plasma processes are essential technologies for realizing nano & micro manufacturing. We have developed next generation plasma process device "autonomic nano-production device" which can control plasma-surface reaction in real-time. In our talk, novel devices for plasma processes will be introduced.

14:00-14:20

Service safety education

PRIME ENGINEERING CO.,LTD.

aiming at improvement in the safety of the worker in semiconductor fabrication machines and equipment and the FPD manufacture equipment industry, and realizing prevention of an accident disaster.
this is educational contents which can be recommended to people which enter a room in a clean room with confidence.

14:00-14:20

High quality phosphorescent dyes for OLED and functional panels synthesized with microwave technique

MINERVA LIGHT LAB.

High quality phosphorescent dyes for OLED and various functional panels were successfully synthesized by microwave technique. High chemical purity is confirmed with LC-TOFMASS analysis. Advantage of micro wave synthetic method and various microwave chemical reactors are described.

14:30-14:50

Stage R

Technology trend in Precision Electroforming at LEAP

LEAP CO.,LTD

LEAP Co.,Ltd. provides high performance precision electroforming stamps as well as nano-level solutions utilizing the unique SAM (Self Assembled Mono-Layer) technology, the New Ni-W stamps and more.

14:30-14:50

DUV(266nm) Laser Marker for SiC, GaN and Sapphire.

TAKANO

All-New DUV(266nm) Laser Maker. We introduce details of the Maker and Technology.
Characteristics:
 ・Best for SiC, GaN and sapphire.
・Minimize the heat damage by laser ablation.
 ・Low-cost(Initial and Maintenance).
 ・New light source.

15:00-15:20

Stage R

What is special with pure play MEMS foundry Silex Microsystems?

KYODO INTERNATIONAL INC

We will introduce you to the manufacturing achievements, control system and proprietary technology of the world top MEMS Foundry Silex Microsystems

15:30-15:50

Stage R

"Oxygen partial pressure controller"

CANON MACHINERY INC.

It’s the technology that controls oxygen partial pressure in gas. Feature is that it can control the extremely low oxygen partial pressure 10^－30 atm. If this technology is used for the atmosphere control, effects, such as " prevention of oxidation", " reduction", and "valence control" of materials, will be produced.

11:00-11:20

Stage R

Our Distinguished Consignment Synthesis Production of Functional Pigments

TATEYAMA KASEI CO., LTD.

Tateyama Kasei has been engaged in consignment production projects of functional organic chemical synthesis including functional pigments. We will introduce our top-notch techniques, technologies and facilities which can bring out the best quality products.

11:30-11:50

Stage R

Company introduction & Product introduction for TSV

RUDOLPH TECHNOLOGIES JAPAN

Introduce the corporate profile of Rudolph technologies, Inc. and new products for TSV Process.

An Update on TMAH safety and an introduction to next generation alternatives

SACHEM

SACHEM will be presenting helpful information relating to TMAH safety and alternative specialty formularies to TMAH. As leading provider of high purity TMAH, SACHEM continues to innovate and proactively address stringent quality, safety and performance standards. From high purity TMAH technology, TMAH Safety and Toll Blending Services to Mobius System? Chemical Recycling, SACHEM’s expertise enables the design of novel high purity formulation components and innovative services while supporting the industry to ensure safe handling of TMAH in all fabs.

13:00-13:20

Stage L

Thin film mono-crystal silicon technology and its application

O-TEC LTD.

We developed the technology which forms the mono-crystal silicon of a thin film in glass, quartz, sapphire, a SiC board, etc.
Leakage current is less than poly silicon and mobility has the early characteristic.
At this seminar, introducing the fundamental specification of a thin film.

13:30-13:50

Stage R

Processing sample using 5μm-10μm micro tools.

IWATA TOOL CO., LTD.

Compared to laser and etching method, micro precision machine processing has merits, which are suitable for high-mix low-volume production and high shape flexibility.
We will report you the present situation and possibility for the future of machine processing.

14:00-14:20

Stage L

Material and Equipment Technologies for HB-LED Manufacturing

BREWER SCIENCE INC.  

The presentation will focus our leading edge materials and equipment technology for HB-LED and planarization technology. The benefit of material and process solutions for LED will be discussed, as well as thin wafer handling.

14:30-14:50

Stage R

Design of the multivibrator based on gate ICs

PRIME ENGINEERING CO.,LTD.

He design of multi-vibrator based on various gate ICs whose calculated value and measured value of duration in quasi-stable state correspond was described.

14:30-14:50

Stage L

DUV(266nm) Laser Marker for SiC, GaN and Sapphire.

TAKANO

All-New DUV(266nm) Laser Maker. We introduce details of the Maker and Technology.
Characteristics:
 ・Best for SiC, GaN and sapphire.
・Minimize the heat damage by laser ablation.
 ・Low-cost(Initial and Maintenance).
 ・New light source.

15:00-15:20

Stage R

"Oxygen partial pressure controller"

CANON MACHINERY INC.

It’s the technology that controls oxygen partial pressure in gas. Feature is that it can control the extremely low oxygen partial pressure 10^－30 atm. If this technology is used for the atmosphere control, effects, such as " prevention of oxidation", " reduction", and "valence control" of materials, will be produced.

11:30-11:50

Stage R

The development of the plasma processing instrument for locally exposing circuits in semiconductor devices

SANYU CO., LTD

A novel plasma etching instrument has been released, which can locally expose the circuit of an LSI without losing its electric characteristics. The basic technology is introduced with some examples. A table-top sized instrument that uses the same technology will also be demonstrated.

12:00-12:20

Stage R

Infrared Emission Microcope for Failure Analysis (IREM-SIL)

IR SYSTEM CO., LTD.

IREM-SIL : Infrared emission microscope for failure analysis. Their 2.8.N.A. highly resolution Solid Immersion Lens can be use for cutting edge devices.

12:30-12:50

Stage R

VIS/NIR/SWIR TriWave camera for wafer inspection

IR SYSTEM CO., LTD.

TriWave - unique Germanium enhanced VIS/NIR/SWIR camera can be used for optimal alignment on TSV and for wafer inspection system using near infrared transmission of silicon. It can be lower prices due to make usual CMOS mass production.

13:00-13:20

Stage R

Crestec's EB Lithography fabrication services

CRESTEC CORP.

Crestec is a EB Lithography System maker and also offering EB fabrication services. Recently, need for fabrication services is increasing rapidly and those products are used for device development dedicated to research and development. We will introduce actual litho patterns and recent trends at this presentation.

13:30-13:50

Stage R

Introduction of in-line 3D measuring instrument “OLIVIA-XYZ”

FUJI TECHNICAL RESEARCH INC.

We are introducing in-line 3D inspecting instrument OLIVIA-XYZ. That has 3 features.
1) 3D shape measurement of up to 35000 profiles/sec on in-line.
2) Inspecting by 10~100 microns resolution.
3) Total package of software and hardware.
We will introduce the latest case about OLIVIA-XYZ.

14:00-14:20

Stage R

Oxygen partial pressure controller

CANON MACHINERY INC.

It’s the technology that controls oxygen partial pressure in gas. Feature is that it can control the extremely low oxygen partial pressure 10^－30 atm. If this technology is used for the atmosphere control, effects, such as " prevention of oxidation", " reduction", and "valence control" of materials, will be produced. 

14:30-14:50

Stage R

Service safety education

PRIME ENGINEERING CO.,LTD.

aiming at improvement in the safety of the worker in semiconductor fabrication machines and equipment and the FPD manufacture equipment industry, and realizing prevention of an accident disaster. this is educational contents which can be recommended to people which enter a room in a clean room with confidence.

15:00-15:20

Stage R

Next-generation magnetic field imaging for non-destructive inspection of electric devices

KOBE UNIVERSITY KIMURA LAB.

We have developed a novel non-destructive inspection technique. This technique can visualized the magnetic field distribution corresponding to the current distribution inside the electric devices with non-destruction. In imaging principle, basic equation of magnetic field is solved using the two-dimensional measurement data matrix.

Kulim Hi-Tech Park, Malaysia: Asia's 6-Star Location for Wafer Foundries and Semicon Facilities

KULIM TECHNOLOGY PARK CORPORATION SDN BHD

Kulim Hi-Tech Park (KHTP) in Malaysia is among the best high-tech parks in Asia to host high tech-related industries. From its launching in 1996, KHTP has grown into a 1619-hectares “Integrated Science City” development.  The park will be expanded to more than 4,407 hectares when fully developed.   KHTP now is recognised by multinational corporations (MNCs) for its ease of starting offshore manufacturing operations.
MNCs in KHTP such as Fuji Electric, Hoya Elec., Showa Denko, Toyo Memory, First Solar, Intel, Infineon, and SilTerra carry out manufacturing operations related to semicon, solar module and advanced electronics. The Park is also home to the Advanced Materials Research Centre (AMReC) of SIRIM, and the Malaysian Institute of Microelectronic Systems (MIMOS).
MNCs continue to choose KHTP as their manufacturing location because of the excellent infrastructures which include prime industrial land, high quality power, and abundant clean water.

The application of UHP stainless steel tube fittings in SEMICON Industry

TACHIA YUNG HO MACHINE INDUSTRY CO.,LTD.

1. The feature of stainless steel metal.
2. The requirement of metal piping line in semiconductor manufacturing process.

New Hi-speed 3D X-ray in-line inspection systemfor printed circuit board assembly

SAKI CORPORATION

The combination of Advanced Planer Computor Tomography(pCT)technology,new X-ray tube control system and newly designed X-ray d0etector candetect all kinds of defects such as voids, small solder,bridge,dropped component and head in pillow automatically in time of capturingimages.

2012 Taiwan & South East Asia Semiconductor & LED Market and SEMICON Taiwan & Singapore Introduction Seminar
SEMI Taiwan

While global semiconductor market is slowing down, Taiwan and South East Asia region remain the top spenders in 2012 with estimated total US$12B for semiconductor equipment for the two regions and US$17B for materials.  The rising demand of advanced technologies such as 3DIC, copper wire also drive the investment momentum from foundries, OSAT and IDMs such as TSMC, UMC, ASE , SPIL and Powertech.  For LED segment, Taiwan LED epi/chip makers are expected to invest more than US$700M to their facilities in Taiwan and China in 2012.  Facing this global industry transition, please join us to learn the most updated market information of these two regions to get you connected to the infinite business opportunity through SEMICON Taiwan and Singapore!

For more information and a RSVP form, please click here.

New Hi-speed 3D X-ray in-line inspection systemfor printed circuit board assembly

SAKI CORPORATION

The combination of Advanced Planer Computor Tomography(pCT)technology,new X-ray tube control system and newly designed X-ray d0etector candetect all kinds of defects such as voids, small solder,bridge,dropped component and head in pillow automatically in time of capturingimages.

Market update by GES

GE CAPITAL GLOBAL ELECTRONICS SOLUTIONS

We will present GES service capability and sharing current market status with you.

Japan Semiconductor Engineering Network Association(JSENA)

JAPAN SEMICONDUCTOR ENGINEERING NETWORK ASSOCIATION

Japan Semiconductor Engineering Network Association(JSENA), an NPO, will proudly celebrate its 10th anniversary in 2012.  JSENAs main activities include providing trade information on through various types of meetings and supporting consultation for individual members and reinforcement of cooperation between the members.

Forecast of Secondary Equipment Market

SURPLUSGLOBAL, INC.

To present the circumstances of secondary semiconductor equipment market in order to understand its history and the process of development. To review the secondary semiconductor equipment market for 2011. To forecast the secondary semiconductor equipment market for 2012.

Semiconductor Turn Key Equipment Refurbishment, Software License, Size and Chamber Retrofits, Warranty, Support/Spares, and Engineering Upgrades for Applied Materials Equipment 200mm and below.

SSSCo

SSS Co was built upon a foundation of engineering excellence and an understanding of our customer's absolute necessity for quality. We've assembled the very best engineering team from all facets of the semiconductor industry to leverage decades of experience into each product we offer. Growing since 2001, SSS Co has established credibility by exceeding the requirements of our worldwide customer base. Our Equipment Engineering team averages over 15 years experience in OEM field service, system manufacturing and semiconductor manufacturing. This core team is the reason for SSS Co's continued success in the difficult field of system refurbishment.

Introduction of YFE-SEMI Service and Proposal ｏｆ Service Function Outsoursing.

YOKOGAWA FIELD ENGINEERING SERVICE CORP.

Introduction of YFE-SEMI Service, Maker-Original and Maker=Authorized Service for YOKOGAWA LSI Tester and Front-end tools including Plasma Etcher,Horizontal Furnace, CMP, etc. Proposal of service function outsourcing including engineering service, repair ,etc.

Back end used equipment market trend : Take advantage of smart capital investment!

INTERTEC CORP.

Intertec corp. has 12 years experience in back end equipment dealing. Experienced equipment trader will introduce industrial structure. If you want to take maximum advantage of buying used equipment you do not want to miss it!

We will do it up to here!　Full Refurbishment by Apex/Semitech

APEX.INC

Semitech, the parent company of Apex, has been performing refurbishment of so many equipments as an authorized agency for OEM. This time we would like to introduce the high quality of our full refurbishment with some pictures.

We provide the best relief to you when you continue to use EOSL (End Of Service Life) computers.

SHARED SOLUTION SERVICE CO.,LTD.

Inside your semiconductor equipments, some EOSL(End Of Service Life)computers may still work. If those computers break down, the impact should spread over the whole equipments. We, Shared Solution Service, provide maintenance services, refurbished parts and technical consultation to those computers. Our motto is to provide the best relief to you.

10:00-17:00

Room 103

YIELD FORUM 11 Japan 

RUDOLPH TECHNOLOGIES JAPAN

12:30-13:20

Room 1

NFPA 79-2012 American Electrical Standard for Industrial Machinery Major revisions from the 2007 edition

QSES INC.

This is the electrical standard for the American industrial machines, and is applicable to the electrical and electronic devices of the machines operating with a nominal voltage of 600 volts or less. NFPA 79-2007 was revised and became NFPA 79-2012 this year. In our seminar we explain the major changes and precautions.

13:30-14:20

Room 1

CMP FILTER

WOONGJIN CHEMICAL CO.,LTD.

CMP (Chemical Mechanical Planarization) filter cartridges is constructed of polypropylene microfibers with absolute removal ratings. Multi-layer depth structure assures high dirt holding capacity and long service life. Consistent and reproducible performance.

14:30-15:20

Room 1

Particle detection and removal management system for reticle/mask inspection

HORIBA, LTD.

HORIBA expanded the line-up of reticle/mask inspection equipment and developed the system which can carry out particle detection and particle removal on reticle/mask sequentially
combining the inspection equipment, automatic substrate transport and particle removing unit.
We introduce the system design and the possible application.

15:30-16:20

Room 1

Introduction of the Laser Scattering Particle Size Distribution Analyzer and its nano particle application.

HORIBA, LTD.

We introduce the laser scattering particle size distribution analyzer and its nano particle application for abrasive slurry and battery applications demonstrating HORIBA's highest accuracy and reproducibility performance.

10:30-11:20

Waste Treatment by Atmospheric Pressure Plasmas

CLEAN TECHNOLOGY CO., LTD.

Thermal plasmas generated under atmospheric pressure provide high temperature about 10,000 K as well as chemical reactivity due to radicals and ions. The characteristics and application of thermal plasmas will be introduced with overview of the present status of waste treatment using thermal plasmas.

11:30-12:20

Room 1

Monitoring MOCVD precursor concentration using infrared technology

HORIBA STEC, CO., LTD.

We release new NDIR vapor concentration monitor for high demands for accurate concentration monitoring of precursors in MOCVD tools. We present our new product, the principle of operation, the measurement data, the performance specification and the applications.

11:30-12:20

Room 2

 Safety Design Update 

SAFE TECHNO LIMITED

Part1: The new topics of Safety Standards
Part2: The new topics of US Field Evaluation

12:30-13:20

Room 1

Miracle new material UDCS Ultra Damping Ceramics

NIPPON SCHNEEBERGER K.K.

UDCSTM,a newly invented ceramic material,which is effectively damping vibrations and noises in demanding motion applications.Yet it obtains high rigidity property as conventional ceramics. Due to its unique characteristics UDCSTM can be easily machined,designed into your mechatronics system and reduces the tuning effort for the motion systems.

12:30-13:20

Room 2

Wafer bonding technology for 3D stacking and integration

SUSS MICROTEC KK

We will present our latest technologies for 3D wafer stacking and integration, including temporary bonding/de-bonding for thin wafer processing/handling and also permanent bonding such as hybrid bonding and fusion bonding.

13:30-14:20

Room 1

Miracle new material UDCS Ultra Damping Ceramics

NIPPON SCHNEEBERGER K.K.

UDCSTM,a newly invented ceramic material,which is effectively damping vibrations and noises in demanding motion applications.Yet it obtains high rigidity property as conventional ceramics. Due to its unique characteristics UDCSTM can be easily machined,designed into your mechatronics system and reduces the tuning effort for the motion systems.

13:30-14:20

Room 2

EVG Solutions to Technical Issues on TSV process and Thin-wafer Handling

EVGROUP JAPAN K.K.

TSVs are becoming applied to a wide range of LSI products as well as image sensors which has been already in mass production. Detail of EVG solutions to technical issues on TSV processes will be presented in the seminar especially about TB/DB (Temporary Bonding / Debonding) technology.

14:30-15:20

Room 1

"New three-dimensional AFM for CD measurement and sidewall characterization"

PARK SYSTEMS JAPAN INC.

New 3D AFM, designed on a decoupled XY & Z scanner platform, enables tilting of the independent Z head for easy access to the sample structure's sides for CD and high resolution sidewall characterization. Also its non-contact mode allows non-destructive measurement of soft photoresists.

14:30-15:20

Room 2

Introduction of the new edition of NFPA 79:2012: Electrical Standard for Industrial Machinery

TUV RHEINLAND JAPAN, LTD.

The new edition of NFPA 79 will officially come into force in 2012.  It is essential to understand and apply the new/revised requirements correctly at the design stage of machine's electrical circuits.  We give an overview of the main differences from the 2007 edition. e.g. discharge means for capacitor, cableless controls, types of permitted cables etc.

15:30-16:20

Room 1

Technologies and Equiments by SPP

SUMITOMO PRECISION PRODUCTS CO.,LTD.

As leadeing manufacturer of deep silicon etching of MEMS & Semiconductor, we offer various MEMS process equiment solutions based on a wealth of experiences we have accumulated over the years in collaboration with SPTS(UK) and Primaxx(USA).

12:30-13:20

Room 1

Advanced technique for device analysis by cutting edge FE-SEM

HITACHI HIGH-TECHNOLOGIES CORP.

SEM is more important tool for device analysis. This time, we would like to introduce the basic principle and actual application for observation technique.

12:30-13:20

Room 2

<1>Introduction of Single FIB Device of Excellent Operationality

<2>JEM-2800

JEOL LTD.

We will introduce the feature of high speed processing and excellent operationality, thanks to the use of stage navigation system and CAD navigation system for a new single FIB product, JIB-4000.
We introduce JEM-2800 equipped with a newly developed 100mm2 silicon drift detector (SDD): Centurio.

13:30-14:20

Room 1

Lithography technology update for 3D packaging, power devices, MEMS and LEDs.

USHIO INC.

Updates of USHIO FFPL and Stepper TECHNOLOGIES dedicated for WAFER bumping, TSV, power devices, HBLEDs. Newly developed optical MODULES and TECHNOLOGIES roadmap updates for further cost reduction and beyond. New proposal of UX4-ECO mask convertibility concept for existing lithography processes.

13:30-14:20

Room 2

New face for nano-characterization technique, and Structural analysis of the encapsulant for LED.

TORAY RESEARCH CENTER, INC.

We present the ultra high resolution and high sensitivity characterization of nanostructure by the new Cs-corrected transmission electron microscopy,
and later,we present the structural analysis of silicone polymer used for Light emitting diode encapsulant and the mounted resin after degradation.

14:30-15:20

Room 1

Etching for Non-Volatile materials

HITACHI HIGH-TECHNOLOGIES CORP.

Having an interest in etching for non-volatile materials used in next-generation memory device production, Hitachi introduces the next-genaration non-volatile material etcher for 300mm wafers; developed from Hitachi's extensive experience with non-volatile etch for magnetic head of hard disk drive.

14:30-15:20

Room 2