450mm Executive Forum
450mm Transition Update
Thursday, December 5
Convention Hall A, 2F, International Conference Halls, Makuhari Messe
Japanese-English Interpretation Available
In this session, there will be a comprehensive discussion regarding the status of the transition to 450mm, the effect on the supply chain, and other related issues.
Masao Fukuma, SIRIJ
Industry Transition to 450MM
Paul Farrar Jr. General Manager of G450C will give and update on the Industry transition to 450mm wafers.
Towards a cost-effective 450mm wafer transition
Roger De Keersmaecker
Senior Vice President Strategic Relations
Moore’s Law has made today’s applications possible through a continuous cost reduction of transistors, enabling more complexity, functionality and performance of systems. Scaling will remain important for this purpose, but we are entering times in which scaling will not automatically translate into cost reduction. Unprecedented opportunities together with daunting challenges will shape the IC landscape in the coming years. With respect to opportunities, the development of a personal health management system together with the continuing demand for increased connectivity will drive the IC industry in the coming years.
EUV lithography will be a key enabler for cost-effective scaling. Transitioning towards a larger wafer size is another element that allows staying on the cost curve related to Moore’s Law. A chip cost reduction of 30% can follow from transitioning from a 300mm to a 450mm wafer size, due to an increased manufacturing efficiency. However, major innovations will be needed to achieve the desired cost reduction.
Innovative Lithography Solutions for the 450 mm Transition
Representative Director, Senior Executive Vice President
President of Precision Equipment Company
Nikon will discuss how they are enabling the transition to 450mm through innovative lithography solutions based on extension of their proven 193 immersion core technology and their industry partnership with G450C.
Requirements for a Successful 450mm Transition
Vice President & Deputy General Manager
SPE Marketing & Process Development Division
TOKYO ELECTRON LIMITED
The speaker will talk about TEL`s 450mm tool development status, current problems and issues. Included will be TEL`s collaboration model with Consortia and customers. For tool suppliers, the key for success is to develop <10nm process technology economically. The speaker will conclude by talking about lessons learned so far and by outlining actions that needs to be taken going forward.
450mm Executive Forum:
You may also be interested in the following sessions:
- 450mm Manufacturing EHS and Facilities Seminar
- SEMI EHS Standards Workshop: EHS Challenges for 450mm
- 450mm Transition Status with SEMI Standardization View