SEMICON Japan SuperTHEATER

 

450mm Executive Forum

450mm Transition Update

 

Thursday, December 5
12:30-14:30
Convention Hall A, 2F, International Conference Halls, Makuhari Messe

Japanese-English Interpretation Available

 

In this session, there will be a comprehensive discussion regarding the status of the transition to 450mm, the effect on the supply chain, and other related issues.

 

Session co-chair:

Masao Fukuma, SIRIJ

 

12:30-13:00

G450C_Paul

Industry Transition to 450MM

Paul Farrar
General Manager 
G450C

 

Paul Farrar Jr.  General Manager of G450C will give and update on the Industry transition to 450mm wafers.
The talk will focus on how the IC makers and the Equipment suppliers are working together to reduce the cost of the transition through the G450C consortium activities at CNSE.  This will include the current status of those activities, key milestones and Schedules.  In addition a description of how G450C works with Semi and other Industry organizations to achieve the program goal will be presented.

 

13:00-13:30 imec

Towards a cost-effective 450mm wafer transition

(Presentation in PDF)

 

Roger De Keersmaecker

Senior Vice President Strategic Relations 

imec

 

Moore’s Law has made today’s applications possible through a continuous cost reduction of transistors, enabling more complexity, functionality and performance of systems. Scaling will remain important for this purpose, but we are entering times in which scaling will not automatically translate into cost reduction. Unprecedented opportunities together with daunting challenges will shape the IC landscape in the coming years. With respect to opportunities, the development of a personal health management system together with the continuing demand for increased connectivity will drive the IC industry in the coming years.

EUV lithography will be a key enabler for cost-effective scaling. Transitioning towards a larger wafer size is another element that allows staying on the cost curve related to Moore’s Law. A chip cost reduction of 30% can follow from transitioning from a 300mm to a 450mm wafer size, due to an increased manufacturing efficiency. However, major innovations will be needed to achieve the desired cost reduction.

 

13:30-14:00 NIKON

Innovative Lithography Solutions for the 450 mm Transition
(Presentation in PDF)

 

Kazuo Ushida

Representative Director, Senior Executive Vice President

President of Precision Equipment Company  

Nikon

 

Nikon will discuss how they are enabling the transition to 450mm through innovative lithography solutions based on extension of their proven 193 immersion core technology and their industry partnership with G450C.

 

14:00-14:30 TEL

Requirements for a Successful 450mm Transition

(Presentation in PDF)

 

Akihisa Sekiguchi

Vice President & Deputy General Manager

SPE Marketing & Process Development Division

TOKYO ELECTRON LIMITED

 

The speaker will talk about TEL`s 450mm tool development status, current problems and issues. Included will be TEL`s collaboration model with Consortia and customers. For tool suppliers, the key for success is to develop <10nm process technology economically. The speaker will conclude by talking about lessons learned so far and by outlining actions that needs to be taken going forward.

 

 

Registration

 

450mm Executive Forum:
Free of charge (Registration required)

Register
  • Please show the confirmation mail printout at the entrance of the seminar at least 10 minutes before the starting time. Otherwise, we may decline your entrance depending on the situation. If you do not receive the confirmation mail or lost it, please check "Track your confirmation email" page in the User My Page.
  • When there are seats available, on-site registration will begin 10 minutes prior to the start of the program.

Presentation materials:


  • Presentation materials will be published on this site after the seminar.
  • Some presentations may not be permitted by the speaker to distribute, and therefore are not availble to download partly or wholly.

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