+81.3.3222.5988

English


Floor Plan

Floor Plan

Event Overview: SEMICON Japan 2018

Date: Wednesday, December 12 – Friday, December 14, 2018
Venue: Tokyo Big Sight

 

Main Exhibit Zone 

Front-End Process Zone

  • Design Tools
  • Wafer Manufacturing Equipment
  • Wafer Process Equipment

Components & Materials Zone

Back-end / Overall Process Zone

  • Packaging Equipment
  • Test & Inspection Equipment
  • Fab Facility & Related Equipment
  • Fab & Packaging Materials
  • Softwares & Services

 

SMART APPLICATIONS Zone 

IoT solution, application, device, equipment, components, software and service providers and manufacturers in the following areas:

  • Automotive / Power Device
  • Mobile
  • Security
  • Digital Health / Life Science
  • Sensors / MEMS

 

Pavilion Exhibit Zone

Manufacturing Innovation Pavilion

  • Advanced Lithography
  • 2.5D / 3D IC
  • Innovative Manufacturing Systems & Solutions
  • Specialty Materials
  • OLED / LED / PE Manufacturing Equipment & Materials

 


For inquiries, contact:

SEMI Japan Customer Services
Tel: +81. 3.3222.5988
jcustomer@semi.org

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