+81.3.3222.5988

English


Apply to Exhibit

Apply to Exhibit

Apply to Exhibit

 

Simply follow these 3 easy steps

1.  View FloorPlan and Select Booth Loccation

2.  Submit online Application

3.  Email/Fax the signed form to SEMI JAPAN

 

Booth Fee & Payment Due

Click Here.

 

Application Schedule

Onsite-booth Selection

December 13-15, 2017
Closed

in Special meeting room  (OSS Office)

1st Exhibiotr Applications

January 4 - July 31, 2018

exhibitors choose a booth location

2nd Exhibiotr Applications

after July 31, 2018

exhibitors choose a booth location

 

Event Overview: SEMICON Japan 2018

SEMICON Japan 2018

December 12-14, 2018
Tokyo Big Sight, East Hall 1-5

 

Main Exhibit Zone

Front-End Process Zone

  • Design Tools
  • Wafer Manufacturing Equipment
  • Wafer Process Equipment

Components & Materials Zone

Back-end / Overall Process Zone

  • Packaging Equipment
  • Test & Inspection Equipment
  • Fab Facility & Related Equipment
  • Fab & Packaging Materials
  • Softwares & Services

 

SMART APPLICATIONS Zone 

IoT solution, application, device, equipment, components, software and service providers and manufacturers in the following areas:

  • Smart Manufacturing
  • Smart Automotive
  • FHE/MEMS

 

Pavilion Exhibit Zone 

 Manufacturing Innovation Pavilion

  • Advanced Lithography: EUV, nanoimprint, DSA, multi-patterning
  • Advanced mounting technology, 2.5d, 3D IC: TSV, plating
  • Production management systems & solutions: Defect control and inspections, yield management, automation
  • Precision work technology, special materials: Non-magnetic, lightweight, heat-resistant, corrosion-proof, particle countermeasures
  • Flexible electronics, OLED, LED, and related technologies: Manufacturing technologies, devices, materials

 


For inquiries, contact:

SEMI Japan Customer Services

Tel: +81. 3.3222.5988

jcustomer@semi.org

Share page with AddThis